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GEIA SSB 1.002
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GEIA SSB 1.002 2014 Edition, September 1, 2014
Environmental Tests and Associated Failure Mechanisms
Description / Abstract:
This document is an annex to EIA Engineering Bulletin SSB-1,
Guidelines for Using Plastic Encapsulated Microcircuits and
Semiconductors in Military, Aerospace and Other Rugged
Applications.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
GEIA SSB 1.002 2014 Edition, September 1, 2014
Environmental Tests and Associated Failure Mechanisms