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GEIA SSB 1.003
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GEIA SSB 1.003 Revision A, September 1, 2014
Acceleration Factors
Description / Abstract:
This document is an annex to EIA Engineering Bulletin SSB-1,
Guidelines for Using Plastic Encapsulated Microcircuits and
Semiconductors in Military, Aerospace and Other Rugged
Applications (the latest revision).
This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
GEIA SSB 1.003 Revision A, September 1, 2014
Acceleration Factors