Description / Abstract:
This document is an annex to EIA Engineering Bulletin SSB-1,
Guidelines for Using Plastic Encapsulated Microcircuits and
Semiconductors in Military, Aerospace and Other Rugged
Applications (the latest revision).
The scope of this document is to establish the recommended
minimum qualification and monitoring testing of plastic
encapsulated microcircuits and discrete semiconductors suitable for
potential use in many rugged, military, severe, or other
environments.
Purpose
The purpose of this document is to provide guidance to OEMs in
evaluating device manufacturer flows and in selecting cost
effective, standard products that meet the performance objective
for many of the equipment applications described above.
Device manufacturers may use this document as a guide to develop
process flows to produce standard product for the above
environments. "Best In Class" suppliers can easily meet these
criteria and can readily supply the necessary data to demonstrate
compliance.
This document is not intended for use as a guide for "uprating"
or "upscreening" devices.
It is not the intent of this document to impose requirements on
device manufacturers. Nor is the intent to define specific
requirements for any given device application.
The user of this document must determine the suitability of this
guideline for a specific application.