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EIA-QAB7

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EIA-QAB7 2015 Edition, July 1, 2015 Specification Policy Guide
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Description / Abstract: Purpose

This document has been formulated as a suggested guide in assisting EIA Engineering Department Panels and JEDEC Councils in cooperating with the Defense Department and other Federal agencies in the preparation of suggested reliability requirements for various types of electronic products as part of a program designed to enhance the reliability of defense and related equipment. The document is to be followed merely as a guide and is not intended to limit technical groups in the consideration of the factors to be taken into account in the development of reliability specifications for recommendation to the Government. The document is prepared as a guide to the following EIA Engineering Department Panels and JEDEC Councils:

Component Parts Panel (P)

Electronic Tube Council (JEDEC)

Semiconductor Device Council (JEDEC)

This document is designed to implement the important specification features recommended by the PSMR-1 Report issued by DOD in 1960, and to guide specification writers toward the over-all objectives of making reliability information available in a consistent and orderly form.

This Guide recognizes two fundamental approaches to assurance of high part reliability, which are:

Procedure No. 1 Procedure No. 1 is based on process qualifications with lot-by-lot assessment of the process for evidence of continued qualification at the specified failure rate level.

In this procedure sufficient data are accumulated. to determine whether or not the process is qualified at the specified failure rate level. Raving gained qualification, life tests are run on each subsequent lot and these data are accumulated to evaluate the failure rate level of the process on a continuing basis. The accumulated data are compared to a given criterion to determine if the process remains qualified at the specified failure rate level. This decision is made after each lot completed life test. (See Appendix I for examples for existing documents which illustrate applications of Proceduro No. 1).