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GEIA-HB-0005-3
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GEIA-HB-0005-3 2008 Edition, September 1, 2008
Rework/Repair Handbook to Address the Implications of Lead-Free Electronics
and Mixed Assemblies in Aerospace and High Performance Electronic Systems
Description / Abstract:
This document provides technical background, procurement
guidance, engineering procedures, and guidelines to assist
organizations reworking/repairing aerospace and high performance
electronic systems, whether they were assembled or previously
reworked/repaired using traditional alloys such as SnPb or Pb-free
alloys, or a combination of both solders and surface finishes. This
document contains a review of known impacts and issues, processes
for rework/repair, focused to provide the technical structure to
allow the repair technician to execute the task.
This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term "Rework/Repair" is used as applicable.
NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term "Rework/Repair" is used as applicable.
NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
GEIA-HB-0005-3 2008 Edition, September 1, 2008
Rework/Repair Handbook to Address the Implications of Lead-Free Electronics
and Mixed Assemblies in Aerospace and High Performance Electronic Systems