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SAE AMS3731/10
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SAE AMS3731/10 Revision C, November 1, 2017
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure,
Semiflexible
Description / Abstract:
Form: This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
Application: Primarily for use as a casting or sealing material where high thermal expansion can be tolerated and where flammability resistance is not required.
Application: Primarily for use as a casting or sealing material where high thermal expansion can be tolerated and where flammability resistance is not required.
SAE AMS3731/10 Revision C, November 1, 2017
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure,
Semiflexible